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BTS5210G Ver la hoja de datos (PDF) - Infineon Technologies

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componentes Descripción
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BTS5210G Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Thermal Characteristics
Parameter and Conditions
Symbol
Thermal resistance
junction - soldering point6)7)
junction – ambient6)
@ 6 cm2 cooling area
each channel:
one channel active:
all channels active:
Rthjs
Rthja
Electrical Characteristics
Parameter and Conditions, each of the four channels
at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified
Symbol
Load Switching Capabilities and Characteristics
On-state resistance (Vbb to OUT); IL = 2 A
each channel, Tj = 25°C: RON
Tj = 150°C:
two parallel channels, Tj = 25°C:
see diagram, page 11
Nominal load current
one channel active: IL(NOM)
two parallel channels active:
Device on PCB6), Ta = 85°C, Tj 150°C
Output current while GND disconnected or pulled up8); IL(GNDhigh)
Vbb = 32 V, VIN = 0,
see diagram page 9
Turn-on time9)
IN
to 90% VOUT: ton
Turn-off time
IN
to 10% VOUT: toff
RL = 12
Slew rate on 9)
Slew rate off 9)
10 to 30% VOUT, RL = 12 : dV/dton
70 to 40% VOUT, RL = 12 : -dV/dtoff
BTS 5210G
Values
Unit
min typ max
--
-- 15 K/W
--
--
--
-- 45
--
-- 40
--
Values
Unit
min typ max
-- 110 140 m
-- 210 280
-- 55 70
1.8 2.4
3.4 3.9
-- A
--
--
2 mA
-- 100 250 µs
-- 100 270
0.2
-- 1.0 V/µs
0.2
-- 1.1 V/µs
6) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 14
7) Soldering point: upper side of solder edge of device pin 15. See page 14
8) not subject to production test, specified by design
9) See timing diagram on page 12.
Infineon Technologies AG
5
2003-Oct-01

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