AFBR-5803AZ Ver la hoja de datos (PDF) - HP => Agilent Technologies

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AFBR-5803AZ

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style

HP => Agilent Technologies 

Transmitter Sections

The transmitter section of the

AFBR-5803Z and AFBR-5805Z

series utilize 1300 nm Surface

Emitting InGaAsP LEDs. These

LEDs are packaged in the

optical subassembly portion of

the transmitter section. They

are driven by a custom silicon

IC which converts differential

PECL logic signals, ECL

referenced (shifted) to a +3.3 V

or +5 V supply, into an analog

LED drive current.

Receiver Sections

The receiver sections of the

AFBR-5803Z and AFBR-5805Z

series utilize InGaAs PIN

photodiodes coupled to a

custom silicon transimpedance

preamplifier IC. These are

packaged in the optical sub-

assembly portion of the

receiver.

These PIN/preamplifier combi-

nations are coupled to a

custom quantizer IC which

provides the final pulse

shaping for the logic output

and the Signal Detect function.

The data output is differential.

The signal detect output is

single-ended. Both data and

signal detect outputs are PECL

compatible, ECL referenced

(shifted) to a +3.3 V or +5 V

power supply.

Package

The overall package concept

for the Agilent transceivers

consists of the following basic

elements; two optical

subassemblies, an electrical

subassembly and the housing

as illustrated in Figure 1 and

Figure 1a.

The package outline drawings

and pin out are shown in

Figures 2, 2a and 3. The

details of this package outline

and pin out are compliant

with the multisource definition

of the 1 x 9 SIP. The low

profile of the Agilent

transceiver design complies

with the maximum height

allowed for the duplex SC

connector over the entire

length of the package.

The outer housing including

the duplex SC connector

receptacle or the duplex ST

ports is molded of filled

nonconductive plastic to

provide mechanical strength

and electrical isolation. The

solder posts of the Agilent

design are isolated from the

circuit design of the

transceiver and do not require

connection to a ground plane

on the circuit board.

The optical subassemblies

utilize a high volume assembly

process together with low cost

lens elements which result in a

cost effective building block.

The electrical subassembly

consists of a high volume

multilayer printed circuit

board on which the IC chips

and various surface-mounted

passive circuit elements are

attached.

The transceiver is attached to

a printed circuit board with

the nine signal pins and the

two solder posts which exit

the bottom of the housing. The

two solder posts provide the

primary mechanical strength to

withstand the loads imposed

on the transceiver by mating

with duplex or simplex SC or

ST connectored fiber cables.

The package includes internal

shields for the electrical and

optical subassemblies to ensure

low EMI emissions and high

immunity to external EMI

fields.

DIFFERENTIAL

DATA OUT

SINGLE-ENDED

SIGNAL

DETECT OUT

ELECTRICAL SUBASSEMBLY

DUPLEX SC

RECEPTACLE

PIN PHOTODIODE

QUANTIZER IC

PREAMP IC

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

LED

DATA IN

DRIVER IC

Figure 1. SC Connector Block Diagram.

TOP VIEW

2

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