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AFBR-5803AQZ

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low Cost 1 x 9 Package Style

Avago Technologies 

Transmitter Sections

The transmitter section of the AFBR-5803AQZ and AFBR-

5805Z series utilize 1300 nm Surface Emitting InGaAsP

LEDs. These LEDs are packaged in the optical subassem-

bly portion of the transmitter section. They are driven

by a custom silicon IC which converts differential PECL

logic signals, ECL referenced (shifted) to a +3.3 V or +5 V

supply, into an analog LED drive current.

Receiver Sections

The receiver sections of the AFBR-5803AQZ and AFBR-

5805Z series utilize InGaAs PIN photo­diodes coupled to

a custom silicon transimpedance preampli­fier IC. These

are packaged in the optical sub­assembly portion of the

receiver.

These PIN/preamplifier com­bi­nations are coupled to

a custom quantizer IC which provides the final pulse

shaping for the logic output and the Signal Detect

function. The data output is dif­ferential. The signal detect

output is single-ended. Both data and signal detect

outputs are PECL compat­ible, ECL referenced (shifted) to

a +3.3 V or +5 V power supply.

Package

The overall package concept for the Avago Technologies

transceivers consists of the following basic elements; two

optical subassemblies, an electrical subassembly and the

housing as illustrated in Figure 1 and Figure 1a.

The package outline drawings and pin out are shown in

Figures 2, 2a and 3. The details of this package outline

and pin out are compliant with the multi­source definition

of the 1 x 9 SIP. The low profile of the Avago Technologies

transceiver design complies with the maximum height

allowed for the duplex SC connector over the entire

length of the package.

The optical subassemblies utilize a high volume assembly

process together with low cost lens elements which result

in a cost effective building block.

The electrical subassembly con­sists of a high volume

multilayer printed circuit board on which the IC chips

and various surface-mounted passive circuit elements

are attached.

The package includes internal shields for the electrical

and optical subassemblies to ensure low EMI emissions

and high immunity to external EMI fields.

The outer housing including the duplex SC connector

receptacle or the duplex ST ports is molded of filled

nonconductive plastic to provide mechanical strength

and electrical isolation. The solder posts of the Avago

Technologies design are isolated from the circuit design

of the transceiver and do not require connection to a

ground plane on the circuit board.

The transceiver is attached to a printed circuit board with

the nine signal pins and the two solder posts which exit

the bottom of the housing. The two solder posts provide

the primary mechanical strength to withstand the loads

imposed on the trans­ceiver by mating with duplex or

simplex SC or ST connectored fiber cables.

DIFFERENTIAL

DATA OUT

SINGLE-ENDED

SIGNAL

DETECT OUT

ELECTRICAL SUBASSEMBLY

DUPLEX SC

RECEPTACLE

PIN PHOTODIODE

QUANTIZER IC

PREAMP IC

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

LED

DATA IN

DRIVER IC

Figure 1. SC Connector Block Diagram.



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