ADP2105(Rev0) Ver la hoja de datos (PDF) - Analog Devices
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ADP2105 Datasheet PDF : 32 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN, EN, SS, COMP, OUT_SENSE/FB to
AGND
LX1, LX2 to PGND
PWIN1, PWIN2 to PGND
PGND to AGND
GND to AGND
PWIN1, PWIN2 to IN
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
−0.3 V to (VIN + 0.3 V)
−0.3 V to +6 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP2105/ADP2106/ADP2107
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA 1
Unit
16-Lead LFCSP_VQ/QFN
40
°C/W
Maximum Power Dissipation
1
W
1 θJA is specified for the worst-case conditions; that is, θJA is specified for device
soldered in circuit board for surface mount packages.
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to
the PCB.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 5 of 32
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