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ADG752BRM Datasheet PDF : 8 Pages
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ADG752
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs2 . . . . . . . . . . . . –0.3 V to VDD +0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . .100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . (TJ Max–TA)/θJA
Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . .+150°C
µSOIC Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
SOT-23 Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 229.6°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 91.99°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . .+215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability. Only one absolute maxi-
mum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
PIN CONFIGURATIONS
8-Lead SOIC
(RM-8)
6-Lead SOT-23
(RT-6)
NC 1
8D
S2 2
ADG752
TOP VIEW
7 VDD
GND 3 (Not to Scale) 6 S1
IN 4
5 NC
NC = NO CONNECT
D1
6 S2
VDD 2
ADG752
TOP VIEW
5 GND
S1 3 (Not to Scale) 4 IN
Table I. Truth Table
ADG752 IN
Switch S1
Switch S2
0
ON
OFF
1
OFF
ON
TERMINOLOGY
VDD
GND
S
D
IN
RON
∆RON
RFLAT(ON)
IS (OFF)
ID, IS (ON)
VD (VS)
CS (OFF)
CD, CS (ON)
tON
tOFF
tD
Off Isolation
Crosstalk
Most positive power supply potential.
Ground (0 V) reference.
Source terminal. May be an input or output.
Drain terminal. May be an input or output.
Logic control input.
Ohmic resistance between D and S.
On resistance match between channels, i.e.,
RONmax–RONmin.
Flatness is defined as the difference between
the maximum and minimum value of on resis-
tance as measured over the specified analog
signal range.
Source leakage current with the switch “OFF.”
Channel leakage current with the switch “ON.”
Analog voltage on terminals D and S.
“OFF” switch source capacitance.
“ON” switch capacitance.
Delay between applying the digital control
input and the output switching on. See Test
Circuit 4.
Delay between applying the digital control
input and the output switching off.
“OFF” time or “ON” time measured between
the 90% points of both switches, when switch-
ing from one address state to another.
A measure of unwanted signal coupling
through an “OFF” switch.
A measure of unwanted signal that is coupled
through from one channel to another as a
result of parasitic capacitance.
Bandwidth
On Response
The frequency at which the output is attenu-
ated by –3 dBs.
The frequency response of the “ON” switch.
Insertion Loss Loss due to the ON resistance of the switch.
VINL
VINH
IINL(IINH)
IDD
Maximum input voltage for Logic “0.”
Minimum input voltage for Logic “1.”
Input current of the digital input.
Positive supply current.
ORDERING GUIDE
Model
Temperature Range
Brand*
ADG752BRM
–40°C to +85°C
SEB
ADG752BRT
–40°C to +85°C
SEB
*Brand on these packages is limited to three characters due to space constraints.
Package Descriptions
µSOIC
SOT-23
Package Options
RM-8
RT-6
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG752 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. 0
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