SP4425CN Ver la hoja de datos (PDF) - Signal Processing Technologies

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SP4425CN

Electroluminescent Lamp Driver Low Voltage Applications

Signal Processing Technologies 

(T= 25°C; VDD = 3.0V; Lamp Capacitance = 4nF with 100Ω Series resistance; Coil = 2mH/44ohms; COSC = 180pF, CINT = 470pF unless otherwise noted)

PARAMETER

MIN.

TYP.

MAX. UNITS

CONDITIONS

Supply Voltage, VDD

Supply Current, I +I

COIL DD

Coil Voltage, VCOIL

HON Input Voltage, VHON

LOW: EL off

HIGH: EL on

HON Current, EL on

Shutdown Current, ISD=ICOIL+IDD

INDUCTOR DRIVE

2.2

3.0

3.3

V

28

35

mA V =V =3V

HON DD

VDD

3.3

V

-0.25

0

0.25V

V

VDD-0.25

VDD

VDD+0.25

5

20

µA

internal pulldown, VHON=VDD=3V

1

8

µA

VHON=0V

Coil Frequency, fCOIL=fLAMPx64

Coil Duty Cycle

28.8

kHz

90

%

Peak Coil Current, IPK-COIL

EL LAMP OUTPUT

90

mA Guaranteed by design.

EL Lamp Frequency, f

LAMP

Peak to Peak Output Voltage

350

275

450

550

775

Hz

TAMB=+25OC, VDD=3.0V

TAMB=-40OC to +85OC, VDD=3.0V

120

150

170

190

120

T =+25OC, V =2.2V

AMB

DD

VPP

TAMB=+25OC, VDD=3.0V

TAMB=-40OC to +85OC, VDD=3.0V

This data sheet specifies environmental parameters, final test conditions and limits as well suggested operating conditions.

For applications which require performance beyond the specified condition and or limits please consult the factory.

Bonding Diagram:

HON

VDD

EL1

PAD

VDD

EL1

X

261.0

813.0

Y

427.0

429.0

EL2

813.0

28.0

D1

813.0

-172.0

COSC

COIL

767.0

-381.0

VSS

143.5

-412.0

EL2

COSC

-790.0

-157.5

HON

-785.5

402.0

73 x 46

MS666

VSS

NOTES:

D1

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125x125 typical.

Coil

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 10 mils +/- 1.

5. Pad center coordinates are relative to die center.

6. Die size 74 x 44 mils.

SP4425DS/20

SP4425 Electroluminescent Lamp Driver

3

© Copyright 2000 Sipex Corporation

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