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TF70908B Ver la hoja de datos (PDF) - Dynex Semiconductor

Número de pieza
componentes Descripción
Fabricante
TF70908B
Dynex
Dynex Semiconductor Dynex
TF70908B Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TF709..Y
SURGE RATINGS
Symbol
Parameter
I
Surge (non-repetitive) on-state current
TSM
I2t
I2t for fusing
Conditions
10ms half sine; V = 0% V , T = 125˚C
R
RRM j
10ms half sine; VR = 0% VRRM, Tj = 125˚C
Max. Units
12.0
kA
720 x 103 A2s
THERMAL AND MECHANICAL DATA
Symbol
Parameter
Rth(j-c)
Thermal resistance - junction to case
Rth(c-h)
Thermal resistance - case to heatsink
T
Virtual junction temperature
vj
T
Storage temperature range
stg
-
Clamping force
Conditions
Double side cooled
dc
Single side cooled
Anode dc
Cathode dc
Clamping force 10.0kN
with mounting compound
Double side
Single side
On-state (conducting)
Reverse (blocking)
Min. Max. Units
-
0.04 oC/W
- 0.072 oC/W
- 0.096 oC/W
-
0.01 oC/W
-
0.02 oC/W
-
125
oC
-
125
oC
-40 150
oC
14.25 15.75 kN
MEASUREMENT OF RECOVERED CHARGE - QRA1
Measurement of QRA1 : QRA1 = IRR x tRR
2
ITM
tp = 1ms
dIR/dt
QRA1
0.5x IRR
IRR
2/13

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