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HA7-5102 Ver la hoja de datos (PDF) - Intersil

Número de pieza
componentes Descripción
Fabricante
HA7-5102 Datasheet PDF : 5 Pages
1 2 3 4 5
HA-5102/883
Die Characteristics
DIE DIMENSIONS:
98.4 x 67.3 x 19 mils ± 1 mils
2500 x 1710 x 483µm ± 25.4µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
GLASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1.5kÅ
WORST CASE CURRENT DENSITY:
1.43 x 105A/cm2 at 10mA
SUBSTRATE POTENTIAL (Powered Up):
Unbiased
TRANSISTOR COUNT: 93
PROCESS: Bipolar Dielectric Isolation
Metallization Mask Layout
HA-5102/883
V-
+IN1
-IN1
OUT1
+IN2
-IN2
OUT2
V+
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Spec Number 511019-883
113

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