E-L6210 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

E-L6210

Dual Schottky diode bridge

STMicroelectronics 

Package information

4

Package information

L6210

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 5. PDIP 16 mechanical data and package dimensions

DIM.

MIN.

mm

TYP. MAX. MIN.

inch

TYP. MAX.

A

5.330

0.2098

A1 0.380

0.0150

A2 2.920 3.300 4.950 0.1150 0.1299 0.1949

b 0.360 0.460 0.560 0.0142 0.0181 0.0220

b2 1.140 1.520 1.780 0.0449 0.0598 0.0701

c 0.200 0.250 0.360 0.0079 0.0098 0.0142

D(*) 18.670 19.180 19.690 0.7350 0.7551 0.7752

E 7.620 7.870 8.260 0.3000 0.3098 0.3252

E1(*) 6.100 6.350 7.110 0.2402 0.2500 0.2799

e

2.540

0.1000

e1

17.780

0.7000

eA

7.620

0.3000

eB

10.920

0.4299

L 2.920 3.300 3.810 0.1150 0.1299 0.1500

(*)“D” and “E1” dimensions do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.25mm.

OUTLINE AND

MECHANICAL DATA

PDIP 16

6/8

0015895_E

0015895 E

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