Version 1.0
SFH 3410
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2
3
Time tS
TSmin to TSmax
tS
60
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
TL
Time above liquidus temperature
tL
100
120
2
3
217
80
100
Peak temperature
TP
245
260
Time within 5 °C of the specified peak tP
10
20
30
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
Time
25 °C to TP
3
6
480
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
OHA04612
Unit
Einheit
K/s
s
K/s
°C
s
°C
s
K/s
s
2007-04-02
8