MADP-007155-0287DT Ver la hoja de datos (PDF) - M/A-COM Technology Solutions, Inc.
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MADP-007155-0287DT Datasheet PDF : 10 Pages
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SMPP Series
Surface Mount Plastic PIN Diodes
Mounting Information
The illustration indicates the recommended
mounting pad configuration for the SOT-23,
SOT-323 , SOD-323, SOT-143, and SC-79
packages. Solder paste containing flux should be
screened onto the pads to a thickness of 0.005-
0.007 inches. The plastic package is placed in
position, firmly adhering to the solder paste.
Permanent attachment is performed by a reflow
soldering procedure during which the tab
temperature does not exceed +275 C and the
body temperature does not exceed +250 C, for
standard models and +260 C for the RoHS
compliant devices.
Please refer to Application Note M538 for
surface mounting instructions.
SOT-323
0.030
0.80
0.030
0.80
0.030
0.80
0.075
1.9
0.030
0.80
Dimenstions: inches
mm
SOT-143
0.115
2.92
0.045
1.17
0.030
0.76
0.035
0.89
0.045
1.14
0.045
1.14
0.031
0.79
0.106
2.69
Dimenstions: inches
mm
SOT-23
.030 min.
0.80
Rev. V22
.035 min.
0.90
.090
2.2
.037
0.95
0.75
1.9
Dimenstions: inches
mm
SOD-323
0.030
0.80
0.030
0.80
0.030
0.80
.090
2.2
Dimenstions: inches
mm
SC-79
0.020
0.50
0.020
0.50
0.053
1.35
Dimenstions: inches
mm
9
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Visit www.macom.com for additional data sheets and product information.
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