MIC5201
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Storage Temperature Range
Lead Temperature
TJ
–40
—
+125
°C —
—
—
—
+260
°C Soldering, 5 sec.
Package Thermal Resistance
Thermal Resistance SOT-223
θJC
—
15
θJA
—
62
—
See Thermal
—
°C/W Considerations Layout
for more information.
Thermal Resistance 8-Ld SOIC
θJA
—
160
See Thermal
—
°C/W Considerations Layout
for more information.
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005718A-page 6
2017 Microchip Technology Inc.