MSP1N6111AUS Ver la hoja de datos (PDF) - Microsemi Corporation

Número de pieza

componentes Descripción

Fabricante

MSP1N6111AUS

Voidless Hermetically Sealed Surface Mount Bidirectional Transient Voltage Suppressors

Microsemi Corporation 

1N6103AUS – 1N6137AUS

PACKAGE DIMENSIONS

Ltr

BD

BL

ECT

S

Dimensions

Inch

Millimeters

Min Max Min Max

0.137 0.148 3.48 3.76

0.200 0.225 5.08 5.72

0.019 0.028 0.48 0.71

0.003 -

0.08

-

Notes

4

NOTES:

1. Dimensions are in inches.

2. Millimeters are given for general information only.

3. Minimum clearance of glass body to mounting surface on all orientations.

4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.

PAD LAYOUT

DIM

INCH

MILLIMETERS

A1

0.288

7.32

A2

0.144

3.66

B

0.070

1.78

C

0.155

3.94

NOTE: If mounting requires adhesive separate from the solder, an additional 0.080 inch

(2.03 mm) diameter contact may be placed in the center between the pads as an

optional spot for cement.

T4-LDS-0277-1, Rev. 1 (121354)

©2013 Microsemi Corporation

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