PTN3460 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza

componentes Descripción

Fabricante

PTN3460

eDP to LVDS bridge IC

NXP Semiconductors. 

NXP Semiconductors

7. Pinning information

7.1 Pinning

PTN3460

eDP to LVDS bridge IC

terminal 1

index area

AUX_N 1

AUX_P 2

GND 3

DP0_P 4

DP0_N 5

VDD(1V8) 6

DP1_P 7

DP1_N 8

RST_N 9

PD_N 10

HPDRX 11

DEV_CFG 12

(1)

VDD(3V3) 13

VDD(3V3) 14

PTN3460BS

42 LVSAE_N

41 LVSAE_P

40 LVSBE_N

39 LVSBE_P

38 VDD(3V3)

37 LVSCE_N

36 LVSCE_P

35 LVSCKE_N

34 LVSCKE_P

33 PVCCEN

32 LVSDE_N

31 LVSDE_P

30 DDC_SDA

29 DDC_SCL

002aaf833

Transparent top view

(1) Center pad is connected to PCB ground plane for electrical grounding and thermal relief.

Fig 3. Pin configuration for HVQFN56

Refer to Section 13 “Package outline” for package and pin dimensions.

PTN3460

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 4 — 12 March 2014

© NXP Semiconductors N.V. 2014. All rights reserved.

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