FSA2267 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza

componentes Descripción

Fabricante

FSA2267

0.35Ω Low-Voltage Dual-SPDT Analog Switch

Fairchild Semiconductor 

FSA2267 / FSA2267A

0.35Ω Low-Voltage Dual-SPDT Analog Switch

January 2007

Features

■ Typical 0.35Ω On Resistance (RON) for +2.7V supply

■ FSA2267A features less than 10µA ICCT current

when S Input is lower than VCC

■ 0.25Ω maximum RON flatness for +2.7V supply

■ 1.6mm x 2.1mm 10-Lead MicroPak™ package

■ Broad VCC operating range

■ Low THD (0.02% typical for 32Ω load)

■ High current handling capability (350mA continuous

current under 3.3V supply)

Applications

■ Cell phone

■ PDA

■ Portable media player

Description

The FSA2267 and FSA2267A are Dual Single Pole Dou-

ble Throw (SPDT) analog switches. The FSA2267 oper-

ates from a single 1.65V to 3.6V supply, while the

FSA2267A operates from a single 2.3V to 4.3V supply.

Each features an ultra-low On Resistance of 0.35Ω at a

+2.7V supply and 25°C. Both devices are fabricated with

sub-micron CMOS technology to achieve fast switching

speeds and designed for break-before-make operation.

FSA2267A features very low quiescent current, even

when the control voltage is lower than the VCC supply.

This feature services the mobile handset applications

very well allowing for the direct interface with baseband

processor general purpose I/Os.

Ordering Information

Product

Package Code Top Lead-

Order Number Number Mark Free

Package Description

Packing

Method

FSA2267L10X MAC010A FC

Yes 10-Lead MicroPak, 1.6 x 2.1mm,

JEDEC MO-255

5K Units on

Tape and Reel

FSA2267MUX MUA10A

(Preliminary)

FSA

2267

Yes 10-Lead Molded Small Outline Package (MSOP), 3K Units on

JEDEC MO-187, 3.0mm Wide

Tape and Reel

FSA2267AL10X MAC010A FD

Yes 10-Lead MicroPak, 1.6 x 2.1mm

JEDEC MO-255

5K Units on

Tape and Reel

FSA2267AMUX MUA10A FSA

(Preliminary)

2267A

Yes 10-Lead Molded Small Outline Package (MSOP), 3K Units on

JEDEC MO-187, 3.0mm Wide

Tape and Reel

Pb-Free package per JEDEC J-STD-020B.

MicroPak™ is a trademark of Fairchild Semiconductor Corporation.

Application Diagram

© 2005 Fairchild Semiconductor Corporation

FSA2267 / FSA2267A Rev. 1.0.2

www.fairchildsemi.com

Share Link: