2003J Ver la hoja de datos (PDF) - Microsemi Corporation
Número de pieza
componentes Descripción
Fabricante
2003J Datasheet PDF : 7 Pages
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CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)
Package
Ambient
Part No. (Note 3) Temperature Range
Connection Diagram
16-PIN CERAMIC DIP
J - PACKAGE
SG2XXXJ/883B
SG2023J/DESC
JAN2001J
JAN2002J
JAN2003J
JAN2004J
SG2XXXJ
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
-55°C to 125°C
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
16-PIN PLASTIC DIP
N - PACKAGE
SG2003N
SG2023N
0°C to 70°C
0°C to 70°C
N Package: RoHS Compliant / Pb-free Transition DC: 0503
N Package: RoHS / Pb-free 100% Matte Tin Lead Finish
20-PIN CERAMIC
LEADLESS CHIP CARRIER
L- PACKAGE
SG2XXXL/883B -55°C to 125°C
SG2XXXL
-55°C to 125°C
3 2 1 20 19
4
18
5
17
6
16
7
15
8
14
9 10 11 12 13
DW Package (Not Pictured) is 16-Pin Wide Body SOIC, same pinout as J package pictured above.
DW Package: RoHS Compliant / Pb-free Transition DC: 0516
DW Package: RoHS / Pb-free 100% Matte Tin Lead Finish
Note 1. Contact factory for JAN and DESC product availability.
2. All parts are viewed from the top.
3. See selection guide for specific device types.
Rev 1.3b
Copyright © 1997
7
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(714) 898-8121 ∞ FAX: (714) 893-2570
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