XU1005-BD Ver la hoja de datos (PDF) - Mimix Broadband
Número de pieza
componentes Descripción
Fabricante
XU1005-BD Datasheet PDF : 8 Pages
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10.0-18.0 GHz GaAs MMIC
Transmitter
March 2007 - Rev 01-Mar-07
Mechanical Drawing
0.169
(0.007)
2.200
(0.087)
2
0.569
(0.022)
3
1.169
(0.046)
4
1.968
2.368
(0.077) (0.093)
5
6
U1005-BD
7
1.824
(0.072)
1.100
(0.043)
1
XU1005-BD
12
11
10
0.0
9
8
0.0
0.169
(0.007)
0.569
(0.022)
1.169
(0.046)
1.968 2.368
(0.077) (0.093)
(Note: Engineering designator is 14TX0614)
3.200
(0.126)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.36 mg.
Bond Pad #1 (LO)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1A) Bond Pad #5 (Vg2) Bond Pad #7 (RF) Bond Pad #9 (Vd2) Bond Pad #11 (Vd1B)
Bond Pad #4 (IF1) Bond Pad #6 (Vg3) Bond Pad #8 (Vd3) Bond Pad #10 (IF2) Bond Pad #12 (Vg1)
Bias Arrangement
Vd1A
Vg1
IF1
2
3
4
Vg2,3
5
6
7 RF
Bypass Capacitors - See App Note [2]
LO 1
XU1005-BD
12
11
10
IF2
Vg1
Vd1B
9
8
Vd2,3
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 8
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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