WS1105 Ver la hoja de datos (PDF) - Avago Technologies
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WS1105 Datasheet PDF : 15 Pages
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PCB Design Guidelines
The recommended WS1105 PCB land pattern is shown
0.7
in Figure 14 and Figure 15. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by 0.5
solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown in Figure 16.
Reducing the stencil opening can potentially generate
more voids. On the other hand, stencil openings larger than
100% will lead to excessive solder paste smear or bridging
across the I/O pads or conductive paddle to adjacent I/O
pads. Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100mm(4mils) or
0.127mm(5mils) thick stainless steel which is capable of
producing the required fine stencil outline.
0.8
1.4
Figure 15. Solder Mask Opening
0.6
0.6
0.4
0.4
0.1
0.8
0.8
0.55
1.325
0.5
1.05
0.25
Figure 14. Metallization
0.3 mm ON
0.5 mm PITCH
1.1
Figure 16. Solder Paste Stencil Aperture
9
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