Production Data
PACKAGE DIMENSIONS
D: 8 PIN SOIC 3.9mm Wide Body
e
8
B
5
EH
1
4
D
A A1
0.10 (0.004)
-C-
SEATING PLANE
L
h x 45o
α
Symbols
A
A1
B
C
D
e
E
h
H
L
α
Dimensions
(mm)
MIN
MAX
1.35
1.75
0.10
0.25
0.33
0.51
0.19
0.25
4.80
5.00
1.27 BSC
3.80
4.00
0.25
0.50
5.80
6.20
0.40
0o
1.27
8o
Dimensions
(Inches)
MIN
MAX
0.0532
0.0688
0.0040
0.0098
0.0130
0.0200
0.0075
0.0098
0.1890
0.1968
0.050 BSC
0.1497
0.1574
0.0099
0.0196
0.2284
0.2440
0.0160
0o
0.0500
8o
REF:
JEDEC.95, MS-012
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
WM2625
DM009.B
C
WOLFSON MICROELECTRONICS LTD
PD Rev 1.0 April 2001
9