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WED3C7410E16M400BC

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBX

RISC Microprocessor Multichip Package

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted

for high performance, space sensitive, low power systems

and supports the following power management features:

doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBX multichip package consists

of:

7410E AltiVec™ RISC processor

Dedicated 2MB SSRAM L2 cache, configured as

256Kx72

21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

Maximum Core frequency = 400, 450MHz

Maximum L2 Cache frequency = 200MHz

Maximum 60x Bus frequency = 133MHz**

The WED3C7410E16M-XBX is offered in Commercial

(0°C to +70°C), industrial (-40°C to +85°C) and military

(-55°C to +125°C) temperature ranges and is well suited

for embedded applications such as missiles, aerospace,

flight computers, fire control systems and rugged critical

systems.

* This product is subject to change without notice.

** At a maximum 60x bus frequency of 133MHz, the maximum

configurable core frequency is 400MHz.

FEATURES

Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

Implementation of Altivec™ technology instruction

set

Optional, high-bandwidth MPX bus interface

FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM

AltiVec™ is a trademark of Motorola Inc.

May 2006

Rev. 9

1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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