WED3C7410E16M-XBHX Ver la hoja de datos (PDF) - White Electronic Designs Corporation

Número de pieza

componentes Descripción

Fabricante

WED3C7410E16M-XBHX

7410E RISC Microprocessor HiTCE™ Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBHX

PRELIMINARY

FIGURE 5 – PIN ASSIGNMENTS

Ball assignments of the 255 CBGA package as viewed from the top surface.

Side profile of the CBGA package to indicate the direction of the top surface view.

July 2004

Rev. 0

4

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

Share Link: