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WED3C7410E16M450BHI

7410E RISC Microprocessor HiTCE™ Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-XBHX

PRELIMINARY*

7410E RISC Microprocessor HiTCE™ Multichip Package

OVERVIEW

The WEDC 7410E/SSRAM multichip package is targeted

for high performance, space sensitive, low power systems

and supports the following power management features:

doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBHX multichip package consists

of:

7410E AltiVec™ RISC processor

Dedicated 2MB SSRAM L2 cache, configured as

256Kx72

21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)

Core frequency = 450 or 400MHz @ 1.8V

Maximum L2 Cache frequency = 200MHz

Maximum 60x Bus frequency = 100MHz

* This product is under development, is not qualified or characterized and is subject to

change without notice.

The WED3C7410E16M-XBHX is offered in Commercial

(0°C to +70°C), industrial (-40°C to +85°C) and military

(-55°C to +125°C) temperature ranges and is well suited

for embedded applications such as missiles, aerospace,

flight computers, fire control systems and rugged critical

systems.

FEATURES

Footprint compatible with WED3C7410E16M-XBX,

WED3C7558M-XBX and WED3C750A8M-200BX

Implementation of Altivec™ technology instruction

set

Optional, high-bandwidth MPX bus interface

HiTCE™ interposer for TCE compatibility to

laminate substrates for increased Board level

reliability

Available with eutectic or high lead solder balls

FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM

AltiVec™ is a trademark of Motorola Inc.

HiTCE™ is a trademark of Kyocera Corp.

July 2004

Rev. 0

1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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