WED3C7410E16M-400BX Ver la hoja de datos (PDF) - White Electronic Designs Corporation

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WED3C7410E16M-400BX

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-400BX

FIG. 5 PIN ASSIGNMENTS

Ball assignments of the 255 CBGA package as viewed from the top surface.

Side profile of the CBGA package to indicate the direction of the top surface view.

White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520

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