WED3C7410E16M-400BX Ver la hoja de datos (PDF) - White Electronic Designs Corporation

Número de pieza

componentes Descripción

Fabricante

WED3C7410E16M-400BX

RISC Microprocessor Multichip Package

White Electronic Designs Corporation 

White Electronic Designs WED3C7410E16M-400BX

RISC Microprocessor Multichip Package *PRELIMINARY

OVERVIEW

The WED3C7410E16M-400BX is offered in Commercial (0°C

The WEDC 7410E/SSRAM multichip package is targeted for

high performance, space sensitive, low power systems and

supports the following power management features: doze,

nap, sleep and dynamic power management.

to +70°C), industrial (-40°C to +85°C) and military (-55°C

to +125°C) temperature ranges and is well suited for em-

bedded applications such as missiles, aerospace, flight

computers, fire control systems and rugged critical systems.

The WED3C7410E16M-400BX multichip package consists

of:

*This data sheet describes a product that is developmental, is not qualified or

characterized and is subject to change without notice.

• 7410E AltiVec RISC processor

• Dedicated 2MB SSRAM L2 cache, configured as

256Kx72

• 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)

• Maximum Core frequency = 400MHz @ 1.8V

• Maximum L2 Cache frequency = 200MHz

FEATURES

n Footprint compatible with WED3C7558M-XBX and

WED3C750A8M-200BX

n Implementation of Altivec technology instruction set

n Optional, high-bandwidth MPX bus interface

• Maximum 60x Bus frequency = 100MHz

FIG. 1 MULTI-CHIP PACKAGE DIAGRAM

AltiVec is a trademark of Motorola Inc.

October 2002 Rev. 5

1

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

Share Link: