25Q64DWFIG Ver la hoja de datos (PDF) - Winbond
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25Q64DWFIG Datasheet PDF : 82 Pages
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W25Q64DW
6. PIN CONFIGURATION SOIC 300-MIL
/HOLD (IO3)
VCC
NC
NC
NC
NC
/CS
DO (IO1)
Top View
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
CLK
DI (IO0)
NC
NC
NC
NC
GND
/WP (IO2)
Figure 1c. W25Q64DW Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
7. PIN DESCRIPTION SOIC 300-MIL
PAD NO.
1
PAD NAME
/HOLD (IO3)
I/O
FUNCTION
I/O
Hold Input (Data Input Output 3)*2
2
VCC
Power Supply
3
N/C
No Connect
4
N/C
No Connect
5
N/C
No Connect
6
N/C
No Connect
7
/CS
I
Chip Select Input
8
DO (IO1)
I/O
Data Output (Data Input Output 1)*1
9
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)*2
10
GND
Ground
11
N/C
No Connect
12
N/C
No Connect
13
N/C
No Connect
14
N/C
No Connect
15
DI (IO0)
I/O
Data Input (Data Input Output 0)*1
16
CLK
I
Serial Clock Input
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
Publication Release Date: January 13, 2011
-7-
Preliminary - Revision C
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