NX25P10 Ver la hoja de datos (PDF) - Winbond

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Fabricante

NX25P10

1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI

Winbond 

W25P10, W25P20 AND W25P40

7.2.11

7.2.12

7.2.13

7.2.14

Chip Erase (C7h)..........................................................................................................20

Power-down (B9h) ........................................................................................................21

Release Power-down / Device ID (ABh) .......................................................................22

Read Manufacturer / Device ID (90h) ...........................................................................24

8. ELECTRICAL CHARACTERISTICS......................................................................................... 25

8.1 Absolute Maximum Ratings (1) .................................................................................... 25

8.2 Operating Ranges......................................................................................................... 25

8.3 Power-up Timing and Write Inhibit Threshold .............................................................. 26

8.4 DC Electrical Characteristics (Preliminary)(1) .............................................................. 27

8.5 AC Measurement Conditions........................................................................................ 28

8.6 AC Electrical Characteristics ........................................................................................ 29

8.7 AC Electrical Characteristics (cont’d) ........................................................................... 30

8.8 Serial Output Timing ..................................................................................................... 31

8.9 Input Timing .................................................................................................................. 31

8.10 Hold Timing................................................................................................................... 31

9. PACKAGE SPECIFICATION .................................................................................................... 32

9.1 8-Pin SOIC 150-mil (Winbond Package Code SN) (NexFlash Package Code N) ....... 32

10. ORDERING INFORMATION .................................................................................................... 33

11. REVISION HISTORY ................................................................................................................ 34

Publication Release Date: November 28, 2005

-3-

Revision M

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