VSC7132 Ver la hoja de datos (PDF) - Vitesse Semiconductor
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VSC7132 Datasheet PDF : 8 Pages
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® VITESSE
SEMICONDUCTOR CORPORATION
Link Replicator for Fibre
Channel, Gigabit Ethernet and HDTV
Preliminary Datasheet
VSC7132
Package Thermal Characteristics
The VSC7132 is packaged into a TSSOP package with 28 leads. The package construction is as shown in
Figure 4. This package allows the VSC7132 to operate with ambient temperatures up to 70oC in still air.
Figure 4: Package Cross Section
Epoxy Die
Plastic Molding Compound
Exposed Leadframe
Wire Bond
Table 4: Thermal Resistance
Symbol
θca-0
θca-100
θca-200
θca-400
θca-600
Description
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Value
45
45
41
37
33
Units
oC/W
oC/W
oC/W
oC/W
oC/W
Moisture Sensitivity Level
This device is rated with a moisture sensitivity level 3 rating. Refer to Application Note AN-20 for appro-
priate handling procedures.
Page 6
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800)-VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52243-0, Rev 3.0
9/21/00
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