VO3062 Ver la hoja de datos (PDF) - Vishay Semiconductors
Número de pieza
componentes Descripción
Fabricante
VO3062 Datasheet PDF : 11 Pages
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www.vishay.com
SMD-6, option 9
Pin 1 and top
of component
0.3 max.
Top
cover
tape
4.09
13.3
1.5 min.
VO3062, VO3063
Vishay Semiconductors
4 ± 0.1
2 ± 0.05
10 pitch cumulative
tolerance on tape
± 0.2
1.75 ± 0.1
10.35
9.14
7.5 ± 0.05
16 ± 0.3
18007
0.1 max.
SOLDER PROFILES
12
Embossment
Direction of feed
Center lines
of cavity
Fig. 17 - Tape and Reel Shipping Medium (1000 pieces on reel)
Ø 1.5
300
5s
250 235 °C to
260 °C
200
Wirst wave
ca. 200 K/s
150
100 °C to
130 °C
100
Axis Title
Lead temperature
Second
wave
ca. 2 K/s
Full line: typical
Dotted lines:
process limits
2 K/s
ca. 5 K/s
50
Forced cooling
10000
1000
100
0
0
948626
10
50
100
150
200
250
Time (s)
Fig. 18 - Wave Soldering Double Wave Profile According to
J-STD-020 for DIP Devices
Axis Title
300
10000
250 255 °C
240 °C
217 °C
200
150
Max. 120 s
100
Max. 260 °C
245 °C
Max. 30 s
1000
Max. 100 s
100
Max. ramp down 6 °C/s
50 Max. ramp up 3 °C/s
0
0
19841
10
50 100 150 200 250 300
Time (s)
Fig. 19 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: Tamb < 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
Rev. 2.2, 17-Apr-18
10
Document Number: 83748
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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