VO3062(2008) Ver la hoja de datos (PDF) - Vishay Semiconductors

Número de pieza

componentes Descripción

Fabricante

VO3062
(Rev.:2008)

Phototriac, Zero Crossing, 1.5 kV/µs dV/dt, 600 V

Vishay Semiconductors 

VO3062, VO3063

Vishay Semiconductors

Phototriac, Zero Crossing,

1.5 kV/µs dV/dt, 600 V

ABSOLUTE MAXIMUM RATINGS

PARAMETER

TEST CONDITION

PART

SYMBOL

VALUE

UNIT

COUPLER

Isolation test voltage

Total power dissipation

Operating temperature range

Storage temperature range

Soldering temperature

t=1s

maximum ≤ 10 s

VISO

Ptot

Tamb

Tstg

Tsld

5300

300

- 40 to + 100

- 55 to + 150

260

VRMS

mW

°C

°C

°C

Note

Tamb = 25 °C, unless otherwise specified.

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied

at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for

extended periods of the time can adversely affect reliability.

120

100

80

IF = 10 mA

60

40

20

21353

0

- 40 - 20

0 20 40 60

Temperature (°C)

80 100

Fig. 1 - On-State Current (RMS) vs. Temperature

Note

The allowable load current was calculated out under a given operating conditions and only for reference:

LED power: QE = 0.015 W, RBA (2-layer) = 72 °C/W

THERMAL CHARACTERISTICS

PARAMETER

TEST CONDITION

SYMBOL VALUE

UNIT

Maximum LED junction temperature

Maximum output die junction temperature

Thermal resistance, junction emitter to board

Thermal resistance, junction emitter to case

Thermal resistance, junction detector to board

Thermal resistance, junction detector to case

Thermal resistance, junction emitter to junction detector

Thermal resistance, case to ambient

Tjmax

Tjmax

θJEB

θJEC

θJDB

θJDC

θJED

θCA

125

125

150

139

78

103

496

3563

°C

°C

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Note

The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the

temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB,

layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's Thermal Characteristics of

Optocouplers Application note.

www.vishay.com

928

For technical questions, contact: optocoupler.answers@vishay.com

Document Number: 83748

Rev. 1.6, 23-Oct-08

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