VO3053 Ver la hoja de datos (PDF) - Vishay Semiconductors

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componentes Descripción

Fabricante

VO3053

Optocoupler, Phototriac Output, Non-Zero Crossing, 1.5 kV/μs dV/dt, 600 V

Vishay Semiconductors 

www.vishay.com

VO3052, VO3053

Vishay Semiconductors

ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

INPUT

Reverse voltage

Forward current - continuous

Power dissipation

OUTPUT

VR

6

V

IF

60

mA

Pdiss

100

mW

Off state output terminal voltage

Peak non-repetitive surge current

Power dissipation

On-state RMS current

COUPLER

VDRM

600

V

PW = 100 ms, 120 pps

ITSM

1

A

Pdiss

200

mW

IT(RMS)

100

mA

Total power dissipation

Operating temperature

Storage temperature

Soldering temperature

10 s

Ptot

300

mW

Tamb

-55 to +100

°C

Tstg

-55 to +150

°C

Tsld

260

°C

Note

• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not

implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute

maximum ratings for extended periods of the time can adversely affect reliability

THERMAL CHARACTERISTICS

PARAMETER

SYMBOL

VALUE

UNIT

Maximum LED junction temperature

Tjmax.

125

°C

TA

Maximum output die junction temperature

Tjmax.

125

°C

Thermal resistance, junction emitter to board

θJEB

150

°C/W

Thermal resistance, junction emitter to case

θJEC

139

°C/W

θCA

TC

θDC

Package

θEC

TJD

θDE

TJE

Thermal resistance, junction detector to board

Thermal resistance, junction detector to case

Thermal resistance, junction emitter to

junction detector

Thermal resistance, case to ambient

θJDB

θJDC

θJED

θCA

78

103

496

3563

°C/W

°C/W

°C/W

°C/W

θDB

19996

θEB

TB

θBA

TA

Note

• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the

temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of

PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal

Characteristics of Optocouplers application note

Rev. 2.2, 12-May-17

2

Document Number: 83749

For technical questions, contact: optocoupleranswers@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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