UPD75117HGK-XXX-8A8 Ver la hoja de datos (PDF) - NEC => Renesas Technology

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UPD75117HGK-XXX-8A8

4-BIT SINGLE-CHIP MICROCOMPUTER

NEC => Renesas Technology 

µPD75116H,75117H

CONTENTS

1. PIN CONFIGURATION (TOP VIEW) ...................................................................................................... 6

2. BLOCK DIAGRAM ................................................................................................................................... 8

3. PIN FUNCTIONS ..................................................................................................................................... 9

3.1 PORT PINS ....................................................................................................................................................... 9

3.2 OTHER PINS ..................................................................................................................................................... 10

3.3 PIN INPUT/OUTPUT CIRCUITS ..................................................................................................................... 11

3.4 RECOMMENDED CONNECTION OF UNUSED PINS ................................................................................... 12

4. MEMORY CONFIGURATION ................................................................................................................. 13

5. PERIPHERAL HARDWARE FUNCTIONS ............................................................................................... 18

5.1 PORT ................................................................................................................................................................. 18

5.2 CLOCK GENERATOR ....................................................................................................................................... 19

5.3 CLOCK OUTPUT CIRCUIT ............................................................................................................................... 20

5.4 BASIC INTERVAL TIMER ................................................................................................................................ 21

5.5 TIMER/EVENT COUNTER ............................................................................................................................... 21

5.6 SERIAL INTERFACE ......................................................................................................................................... 23

5.7 PROGRAMMABLE THRESHOLD PORT (ANALOG INPUT PORT) .............................................................. 25

5.8 BIT SEQUENTIAL BUFFER ............................................................................................................................. 26

6. INTERRUPT FUNCTION ........................................................................................................................ 27

7. STANDBY FUNCTION ............................................................................................................................ 29

8. RESET FUNCTION .................................................................................................................................. 30

9. INSTRUCTION SET ................................................................................................................................. 33

10. APPLICATION EXAMPLE ....................................................................................................................... 43

10.1 CORDLESS TELEPHONE (SUBSET) .............................................................................................................. 43

10.2 DISPLAY PAGER .............................................................................................................................................. 44

11. MASK OPTION SELECTION ................................................................................................................... 45

12. ELECTRICAL SPECIFICATIONS ............................................................................................................. 46

13. PACKAGE INFORMATION ..................................................................................................................... 57

14. RECOMMENDED SOLDERING CONDITIONS ...................................................................................... 59

APPENDIX A. FUNCTIONAL DIFFERENCES AMONG µPD751×× SERIES PRODUCTS ......................... 60

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