µPD6379, 6379A, 6379L, 6379AL
6. RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met for soldering conditions of the product.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Please consult with our sales offices in case other soldering process is used, or in case the soldering is done under
different conditions.
Table 6-1 Soldering Conditions
µPD6379GR, 6379AGR, 6379LGR, 6379ALGR : 8-pin plastic SOP (5.72 mm (225))
Soldering
Process
Infrared ray
reflow
VPS
Wave soldering
Partial heating
method
Soldering Conditions
Peak temperature of package surface: 235 °C or below,
Reflow time: 30 seconds or less (at 210 °C or higher),
Number of reflow processes: MAX. 2.
Peak temperature of package surface: 215 °C or below,
Reflow time: 40 seconds or less (at 200 °C or higher),
Number of reflow processes: MAX. 2.
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less,
Pre-heating temperature: 120 °C or below (Package surface),
Number of flow processes: MAX. 1.
Terminal temperature: 300 °C or below,
Time: 3 seconds or less (Per one side of the device).
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
—
Caution Do not apply more than one soldering method at any one time, except for “Partial heating
method”.
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Data Sheet S11588EJ4V0DS00