UPD3734A Ver la hoja de datos (PDF) - NEC => Renesas Technology
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UPD3734A Datasheet PDF : 20 Pages
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µPD3734A
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Type of Through-hole Device
µPD3734ACY: CCD linear image sensor 22-pin plastic DIP (400 mil)
Process
Conditions
Wave soldering (only to leads) Solder temperature: 260 ˚C or below, Flow time: 10 seconds or less.
Partial heating method
Pin temperature: 260 ˚C or below, Heat time: 10 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
During assembly care should be taken to prevent solder or flux from contacting the plastic cap.
The optical characteristics could be degraded by such contact.
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