2. PIN CONFIGURATION (PAD LAYOUT)
Chip size: 3.75 x 23.00 mm2 TYP.
Bump size (output): 35 x 94 µm2 TYP.
Bump size (input & dummy): 80 x 86 µm2 TYP.
Alignment mark (Mark center, unit: µm)
X
Y
M1
−1690
11315
M2
−1690
−11315
737
Alignment mark reference (unit: µm) 1
734
733
µ PD161623
72 60 72
204
Y(+
X(+
130 µm
185
186
190
189
Data Sheet S15817EJ2V0DS
3