µPC8103T, µPC8108T
ILLUSTRATION OF TEST CIRCUITS ASSEMBLED ON EVALUATION BOARD
SURFACE (IC mounted pattern)
A
C5
B
B’
Backside (Ground pattern)
A’
C2
C3
C4
L
EX-LO
RF IN
C1
R C6
IF OUT
IN
OUT
µPC8103T
8108T
C
D
D’
C’
Note
(*1) 35 × 42 × 0.4 mm double sided copper clad polyimide board
(*2) Solder plated pattern
(*3) Surface vs. backside : A - A’, B - B’, C - C’, D - D’
(*4)
should be removed.
(*5) In the care of NF measurement, remove R and short.
(*6)
: Through holes
7