UPC2715T Ver la hoja de datos (PDF) - NEC => Renesas Technology

Número de pieza

componentes Descripción

Fabricante

UPC2715T

BIPOLAR ANALOG INTEGRATED CIRCUIT

NEC => Renesas Technology 

PPC2715T

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to prevent an increase in ground impedance (which can cause

abnormal oscillation).

(3) Keep the track length of the ground pins as short as possible.

(4) Connect a bypass capacitor (having, for example, a capacitance of 1 000 pF) to the VCC pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and

conditions than the recommended conditions are to be consulted with our sales representatives.

PPC2715T

Soldering method

Infrared ray reflow

VPS

Wave soldering

Pin part heating

Soldering conditions

Package peak temperature: 235 °C,

Hour: within 30 s. (more than 210 °C),

Time: 3 times, Limited days; no.*

Package peak temperature: 215 °C,

Hour: within 40 s. (more than 200 °C),

Time: 3 times, Limited days: no.*

Soldering tub temperature: less than 260 °C,

Hour: within 10 s.

Time: 1 time, Limited days: no.*

Pin area temperature: less than 300 °C,

Hour: within 3 s.

Limited days: no.*

Recommended condition

symbols

IR35-00-3

VP15-00-3

WS60-00-1

*: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.

Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

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