UBA2032 Ver la hoja de datos (PDF) - Philips Electronics

Número de pieza

componentes Descripción

Fabricante

UBA2032

Full bridge driver IC

Philips Electronics 

Philips Semiconductors

Full bridge driver IC

Preliminary specification

UBA2032

THERMAL CHARACTERISTICS

SYMBOL

Rth(j-a)

PARAMETER

thermal resistance from junction to ambient

UBA2032T

UBA2032TS

CONDITIONS

in free air

VALUE

80

100

UNIT

K/W

K/W

QUALITY SPECIFICATION

In accordance with “SNW-FQ-611D”.

CHARACTERISTICS

Tj = 25 °C; all voltages are measured with respect to SGND; positive currents flow into the IC; unless otherwise

specified.

SYMBOL

PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

High voltage

IHV

high voltage supply current

t < 0.5 s and VHV = 550 V

0

−

30

µA

IFSL, IFSR high voltage floating supply

t < 0.5 s and VFSL = VFSR = 564 V 0

−

30

µA

current

IHV(drive)

supply current on pins EXTDR t < 0.5 s and VHV(drive) = 464 V

0

−

30

µA

and +LVS

supply current on pin −LVS

t < 0.5 s and VHV(drive) = 450 V

0

−

30

µA

Start-up; powered via pin HV

Ii(HV)

VHV(rel)

HV input current

level of release power drive

voltage

VHV = 11 V; note 1

−

0.5 1.0 mA

11

12.5 14

V

VHV(UVLO)

VHV(hys)

VDD

reset level of power drive voltage

HV hysteresis voltage

internal supply voltage

VHV = 20 V

8.5 10

11.5 V

2.0 2.5 3.0 V

10.5 11.5 13.5 V

Start-up; powered via pin VDD

Ii(DD)

VDD(rel)

VDD input current

level of release power drive

voltage

VDD = 8.25 V; note 2

−

0.5

8.25 9.0

1.0 mA

9.75 V

VDD(UVLO)

VDD(hys)

reset level of power drive voltage

hysteresis voltage

5.75 6.5

2.0 2.5

7.25 V

3.0 V

2002 Oct 07

9

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