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TZA3044T Ver la hoja de datos (PDF) - Philips Electronics

Número de pieza
componentes Descripción
Fabricante
TZA3044T Datasheet PDF : 28 Pages
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Philips Semiconductors
SDH/SONET STM4/OC12 and
1.25 Gbits/s Gigabit Ethernet postamplifiers
Product specification
TZA3044; TZA3044B
FEATURES
Pin compatible with the NE/SA5224 and NE/SA5225 but
with extended power supply range and less external
component count
Wideband operation from 1.0 kHz to 1.25 GHz typical
Applicable in 622 Mbits/s SDH/SONET receivers and
1.25 Gbits/s Gigabit Ethernet receivers
Single supply voltage from 3.0 to 5.5 V
Positive Emitter Coupled Logic (PECL) compatible data
outputs
Positive Emitter Coupled Logic (PECL) compatible
status outputs (TTL compatible status outputs for the
TZA3044B)
Programmable input signal level detection to be
adjusted using a single external resistor
On-chip DC offset compensation without external
capacitor.
APPLICATIONS
Digital fibre optic receiver for SDH/SONET STM4/OC12
and Gigabit Ethernet applications
Wideband RF gain block.
GENERAL DESCRIPTION
The TZA3044 is a high gain limiting amplifier that is
designed to process signals from fibre optic preamplifiers
like the TZA3043 and TZA3023. It is pin compatible with
the NE/SA5224 and NE/SA5225 but with extended power
supply range, and needs less external components.
Capable of operating up to 1.25 Gbits/s, the chip has input
signal level detection with a user-programmable threshold.
The data and level detection status outputs are differential
outputs for optimum noise margin and ease of use.
The TZA3044B has the same functionality as the
TZA3044, but with TTL compatible status outputs
(pins ST and STQ), and TTL compatible JAM input.
ORDERING INFORMATION
TYPE
NUMBER
TZA3044T
TZA3044TT
TZA3044U
TZA3044BT
TZA3044BTT
TZA3044BU
PACKAGE
NAME
DESCRIPTION
SO16
TSSOP16
SO16
TSSOP16
plastic small outline package; 16 leads; body width 3.9 mm
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
bare die in waffle pack carriers; die dimensions 1.55 × 1.55 mm
plastic small outline package; 16 leads; body width 3.9 mm
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
bare die in waffle pack carriers; die dimensions 1.55 × 1.55 mm
VERSION
SOT109-1
SOT403-1
SOT109-1
SOT403-1
1999 Nov 03
2

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