ADG714BRUZ-REEL7(RevE) Ver la hoja de datos (PDF) - Analog Devices
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ADG714BRUZ-REEL7 Datasheet PDF : 21 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter
VDD to VSS
VDD to GND
VSS to GND
Analog Inputs1
Digital Inputs1
Peak Current, Sx or Dx
Continuous Current, Sx or Dx
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Lead Temperature, Soldering
(10 sec)
Infrared Reflow (20 sec)
Rating
7V
−0.3 V to +7 V
+0.3 V to −3.5 V
VSS −0.3 V to VDD +0.3 V or
30 mA, whichever occurs first
–0.3 V to VDD +0.3 V or 30 mA,
whichever occurs first
100 mA (pulsed at 1 ms, 10%
duty cycle maximum)
30 mA
−40°C to +85°C
−65°C to +150°C
150°C
300°C
235°C
1 Overvoltages at the DIN pin, Sx, or Dx are clamped by internal diodes. Limit
current to the given maximum ratings.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ADG714/ADG715
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment.
Careful attention to PCB thermal design is required.
θJA is the natural convection, junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 7. Thermal Resistance
Package Type
RU-24
CP-24-10
θJA
128
127.991
θJC
42
15.382
Unit
°C/W
°C/W
1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal
test board. See JEDEC JESD-51.
2 Thermal impedance simulated values are based on a cool plate location at
the top of the package and measured at the bottom of the exposed paddle
of the LFCSP.
ESD CAUTION
Rev. E | Page 9 of 21
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