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AD7731BRUZ

Low Noise, High Throughput 24-Bit Sigma-Delta ADC

Analog Devices

AD7731BRUZ Datasheet PDF : 44 Pages

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AD7731

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

AVDD to AGND .................................................. –0.3 V to +7 V

AVDD to DGND .................................................. –0.3 V to +7 V

DVDD to AGND .................................................. –0.3 V to +7 V

DVDD to DGND .................................................. –0.3 V to +7 V

AGND to DGND ................................................ –5 V to +0.3 V

AVDD to DVDD....................................................... –2 V to +5 V

Analog Input Voltage to AGND ........... –0.3 V to AVDD + 0.3 V

Reference Input Voltage to AGND....... –0.3 V to AVDD + 0.3 V

AIN/REF IN Current (Indefinite) .................................... 30 mA

Digital Input Voltage to DGND............ –0.3 V to DVDD + 0.3 V

Digital Output Voltage to DGND ......... –0.3 V to DVDD + 0.3 V

Output Voltage (D0, D1) to DGND...... –0.3 V to AVDD + 0.3 V

Operating Temperature Range

Industrial (B Version) ....................................... –40°C to +85°C

Storage Temperature Range............................ –65°C to +150°C

Junction Temperature .....................................................+150°C

ORDERING GUIDE

Model (Z = RoHS)

AD7731BN

AD7731BNZ

AD7731BR

AD7731BR-REEL

AD7731BR-REEL7

AD7731BRZ

AD7731BRZ-REEL

AD7731BRZ-REEL7

AD7731BRU

AD7731BRU-REEL

AD7731BRU-REEL7

AD7731BRUZ

AD7731BRUZ-REEL

AD7731BRUZ-REEL7

EVAL-AD7731EBZ

Temperature Range

−40°C to +85°C

Plastic DIP Package, Power Dissipation........................450 mW

θJA Thermal Impedance ............................................... 105°C/W

Lead Temperature (Soldering, 10 sec)............................ +260°C

TSSOP Package, Power Dissipation..............................450 mW

θJA Thermal Impedance ............................................... 128°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) ...................................................... +215°C

Infrared (15 sec) ............................................................. +220°C

SOIC Package, Power Dissipation ................................450 mW

θJA Thermal Impedance ................................................. 75°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) ...................................................... +215°C

Infrared (15 sec) ............................................................ +220°C

*Stresses above those listed under Absolute Maximum Ratings may cause

permanent damage to the device. This is a stress rating only; functional

operation of the device at these or any other conditions above those listed in the

operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Package Description

24-Lead PDIP

24-Lead SOIC_W

24-Lead TSSOP

Evaluation Board

Package Option

N-24-1

RW-24

RU-24

RoHS Compliant

Yes

ISINK (800µA AT DVDD = +5V

100µA AT DVDD = +3V)

TO OUTPUT

50pF

+1.6V

ISOURCE (200µA AT DVDD = +5V

100µA AT DVDD = +3V)

Figure 1. Load Circuit for Access Time and Bus Relinquish Time

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

RREEVV.. AA

‐5‐

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