TPD1032F(2006) Ver la hoja de datos (PDF) - Toshiba

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Fabricante

TPD1032F
(Rev.:2006)

Toshiba Intelligent Power Device Silicon Monolithic Power MOS Integrated Circuit

Toshiba 

TPD1032F

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Drain-source voltage

DC

Pulse

Drain current

Input voltage

Power dissipation

(Ta=25℃)(Note 3a)

Single-device operation (Note4a)

Single-device value at dual

operation (Note4b)

Power dissipation

(Ta=25℃)(Note 3b)

Single-device operation (Note4a)

Single-device value at dual

operation (Note4b)

Single pulse active clamp capability (Note 5)

Active clamp current

Repetitive active clamp capability

(Note 6)

Operating temperature

Channel temperature

Storage temperature

VDS

ID

VIN

PD(1)

PD(2)

PD(3)

PD(4)

EAS

IAR

EAR

Topr

Tch

Tstg

20

V

40

Internally limited

A

−0.3 to 7

V

0.95

0.54

W

0.38

0.20

90

mJ

3

A

54

μJ

−40 to 110

°C

150

°C

−55 to 150

°C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report

and estimated failure rate, etc).

Thermal Characteristics

Characteristics

Symbol

Max

Thermal resistance,

Single-device operation

channel (Note 4a)

Rth (ch-a)(1)

132

to ambient

(Note3a) Single-device value at

dual operation (Note 4b)

Rth (ch-a)(2)

231

Thermal resistance,

Single-device operation

channel (Note 4a)

Rth (ch-a)(1)

330

to ambient

(Note3b) Single-device value at

dual operation (Note 4b)

Rth (ch-a)(2)

625

Note 3:

FR-4

25.4 × 25.4 × 0.8

(Unit: mm)

Unit

°C/W

°C/W

FR-4

25.4 × 25.4 × 0.8

(Unit: mm)

(a)

a) Device mounted on a glass-epoxy board (a)

(b)

b) Device mounted on a glass-epoxy board (b)

4

2006-10-31

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