TN1215-600G Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

TN1215-600G

SCR

STMicroelectronics 

TN1215-G

Fig. 7: Non repetitive surge peak on-state current

for a sinusoidal pulse with width tp<10ms, and cor-

responding value of I2t.

Fig. 8: On-state characteristics(maximum values).

ITSM(A),I t(A s)

500

100

ITSM

It

tp(ms)

10

1

2

Tj initial=25°C

ITM(A)

100.0

Tj=Tj max.

10.0

1.0

Tj=25°C

Tj max.:

Vto=0.77V

Rt=30mΩ

VTM(V)

0.1

5

10

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5

Fig. 9: Thermal resistance junction to ambient ver-

sus copper surface under tab (Epoxyprinted circuit

board FR4, copper thickness: 35µm).

Rth(j-a) (°C/W)

80

70

60

50

40

30

20

10

S(Cu) (cm )

0

0 4 8 12 16 20 24 28 32 36 40

Fig. 10: Typical reflow soldering heat profile, either

for mounting on FR4 or metal-backed boards.

T (°C)

250

200

245°C

215°C

150

Epoxy FR4

board

100

50

0

0

Metal-backed

board

t (s)

40 80 120 160 200 240 280 320 360

4/5

®

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