TMP87CH48I Ver la hoja de datos (PDF) - Toshiba
Número de pieza
componentes Descripción
Fabricante
TMP87CH48I Datasheet PDF : 38 Pages
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TMP87PH48/PM48
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
(in Body Text)
(in Body Text)
New Part Number
New Package Code
OTP
TMP87PH48U
P-LQFP64-1010-0.50
TMP87PH48UG
LQFP64-P-1010-0.50E
—
TMP87PH48DF
P-QFP64-1414-0.80A
TMP87PH48DFG
QFP64-P-1414-0.80C
—
TMP87PM48U
P-LQFP64-1010-0.50
TMP87PM48UG
LQFP64-P-1010-0.50E
—
TMP87PM48DF
P-QFP64-1414-0.80A
TMP87PM48DFG
QFP64-P-1414-0.80C
—
*: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix)
Test
Solderability
Test Conditions
(1) Use of Lead (Pb)
·solder bath temperature = 230°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
(2) Use of Lead (Pb)-Free
·solder bath temperature = 245°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
Remark
Leads with over 95% solder coverage
till lead forming are acceptable.
II
2008-03-06
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