TMP36FS(2015) Ver la hoja de datos (PDF) - Analog Devices
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TMP36FS Datasheet PDF : 19 Pages
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TMP35/TMP36/TMP37
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter1, 2
Supply Voltage
Shutdown Pin
Output Pin
Operating Temperature Range
Die Junction Temperature
Storage Temperature Range
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature Range
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
IR Reflow Soldering—Pb-Free Package
Peak Temperature
Time at Peak Temperature Range
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Rating
7V
GND ≤ SHUTDOWN ≤ +VS
GND ≤ VOUT ≤ +VS
−55°C to +150°C
175°C
−65°C to +160°C
220°C (0°C/5°C)
10 sec to 20 sec
3°C/sec
−6°C/sec
6 min
260°C (0°C)
20 sec to 40 sec
3°C/sec
−6°C/sec
8 min
1 Digital inputs are protected; however, permanent damage can occur on
unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper
antistatic handling procedures.
2 Remove power before inserting or removing units from their sockets.
Data Sheet
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device in
socket.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
TO-92 (T-3-1)
162
120
°C/W
SOIC_N (R-8)
158
43
°C/W
SOT-23 (RJ-5)
300
180
°C/W
ESD CAUTION
Rev. H | Page 4 of 19
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