HI-8020(2001) Ver la hoja de datos (PDF) - Holt Integrated Circuits
Número de pieza
componentes Descripción
Fabricante
HI-8020 Datasheet PDF : 6 Pages
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HI-8020/HI-8120 Series
ORDERING INFORMATION
PART
NUMBER
NUMBER OF MASTER PACKAGE
SEGMENTS /SLAVE DESCRIPTION
TEMPERATURE
BURN LEAD
RANGE
FLOW IN FINISH
TTL Input Logic
HI-8020J-85
32
BOTH 44 PIN PLASTIC J LEAD
-40°C TO +85°C I
NO SOLDER
HI-8020S-61
38
MASTER 48 PIN CERAMIC LEADLESS CHIP CARRIER -40°C TO +85°C I
NO GOLD
HI-8020SM-62
38
MASTER 48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M YES SOLDER
HI-8020S-63
38
HI-8020SM-64
38
SLAVE 48 PIN CERAMIC LEADLESS CHIP CARRIER -40°C TO +85°C I
SLAVE 48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M
NO GOLD
YES SOLDER
CMOS Input Logic
HI-8120J-85
32
BOTH 44 PIN PLASTIC J LEAD
-40°C TO +85°C I
NO SOLDER
HI-8120S-61
38
MASTER 48 PIN CERAMIC LEADLESS CHIP CARRIER -40°C TO +85°C I
NO GOLD
HI-8120SM-62
38
MASTER 48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M YES SOLDER
HI-8120S-63
38
SLAVE 48 PIN CERAMIC LEADLESS CHIP CARRIER -40°C TO +85°C I
NO GOLD
HI-8120SM-64
38
SLAVE 48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M YES SOLDER
SEMI-CUSTOM PACKAGING
The above part numbers represent some of the typical configurations of the HI-8020 & HI-8120 products. They can also be provided
with a varied number of output segments (30, 32 and 38), with either industrial or military screening and in a wide variety of packages.
Listed below are currently available packages. Please contact the Holt Sales Department for your specific requirements.
PACKAGE
DESCRIPTION
PLASTIC DUAL-IN-LINE (PDIP)
PLASTIC QUAD FLAT PACK (PQFP)
PLASTIC J-LEAD CHIP CARRIER (PLCC)
CERAMIC DUAL-IN-LINE (CDIP)
CERAMIC LEADLESS CHIP CARRIER (LCC)
CERAMIC J-LEAD CHIP CARRIER
CERAMIC LEADED CHIP CARRIER
NO.
LEADS
40
48
52
44
40
48
40
48
44
48
40
48
HOLT INTEGRATED CIRCUITS
3-13
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