TLP708F Ver la hoja de datos (PDF) - Toshiba

Número de pieza

componentes Descripción

Fabricante

TLP708F

TOSHIBA PHOTOCOUPLER LED & PHOTO-IC

Toshiba 

Soldering and Storage

TLP708 / TLP708F

(1) Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of

whether a soldering iron or a reflow soldering method is used.

1) When Using Soldering Reflow

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

 An example of a temperature profile when lead(Pb)-free solder is used:

(°C)

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used by the customer within the

described profile.

2) When using soldering flow

 Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120 seconds.

 Mounting condition of 260 °C within 10 seconds is recommended.

 Flow soldering must be performed once

3) When using soldering Iron

 Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds

not exceeding 350 °C.

 Heating by soldering iron must be only once per 1 lead

© 2019

8

Toshiba Electronic Devices & Storage Corporation

2019-09-25

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