TLP626,TLP626-2,TLP626-4
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Forward current
Forward current derating
Pulse forward current
Power dissipation (1 circuit)
Power dissipation derating
(Ta ≥ 25°C, 1 circuit)
Junction temperature
Collector−emitter voltage
Emitter−collector voltage
Collector current
Collector power dissipation (1 circuit)
Collector power dissipation derating
(Ta ≥ 25°C, 1 circuit)
Junction temperature
Storage temperature range
Operating temperature range
Lead soldering temperature
Total package power dissipation (1 circuit)
Total package power dissipation derating
(Ta ≥ 25°C, 1 circuit)
Isolation voltage
(Note 1)
Symbol
IF
ΔIF / °C
IFP
PD
Rating
TLP626
TLP626−2
TLP626−4
60
50
−0.7(Ta ≥ 39°C) −0.5(Ta ≥ 39°C)
1(100μs pulse,100pps)
100
70
Unit
mA
mA / °C
A
mW
ΔPD / °C
−1.0
−0.7
mW / °C
Tj
125
°C
VCEO
55
V
VECO
7
V
IC
50
mA
PC
150
100
mW
ΔPC / °C
−1.5
−1.0
mW / °C
Tj
125
°C
Tstg
−55~125
°C
Popr
−55~100
°C
Tsol
260(10s)
°C
PT
250
150
mW
ΔPT / °C
−2.5
−1.5
mW / °C
BVS
5000(AC, 1min., RH≤60%)
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Device considered a two terminal: LED side pins shorted together, and detector side pins shorted together.
Recommended Operating Conditions
Characteristic
Symbol
Min. Typ. Max. Unit
Supply voltage
Forward current
Collector current
Operating temperature
VCC
―
5
24
V
IF(RMS)
―
1.6
20
mA
IC
―
1
10
mA
Topr
−25 ―
75
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
2
2007-10-01