TLP525G-2 Ver la hoja de datos (PDF) - Toshiba

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Fabricante

TLP525G-2

GaAs IRed & Photo−Triac Photocoupler

Toshiba 

TLP525G,TLP525G−2,TLP525G−4

Absolute Maximum Ratings (Ta = 25°C)

Characteristic

Symbol

Forward current

Forward current derating

Pulse forward current

Reverse voltage

Junction temperature

Off−state output terminal

voltage

On−state RMS

current

Ta = 25°C

Ta = 70°C

On−state current derating

(Ta≥25°C)

Peak on state current

Peak nonrepetitive surge

current (PW = 10ms, DC = 10%)

Junction temperature

Storage temperature range

Operating temperature range

Lead soldering temperature

Isolation voltage

(Note)

IF

IF / °C

IFP

VR

Tj

VDRM

IT (RMS)

IT / °C

ITP

ITSM

Tj

Tstg

Topr

Tsol

BVS

TLP525G

50

Rating

TLP525G−2

TLP525G−4

50

−0.7 (Ta ≥ 53°C)

−0.5 (Ta ≥ 25°C)

1 (100μs pulse, 100pps)

5

125

400

100

80

50

40

−1.1

−0.9

2 (100μs pulse, 120pps)

1.2

115

−55~125

−40~100

260 (10s)

2500 (AC, 1min., R.H. ≤ 60%)

Unit

mA

mA / °C

A

V

°C

V

mA

mA / °C

A

A

°C

°C

°C

°C

V rms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note: Device considered a two terminal device: LED side pins shorted together and detector side pins shorted

together.

Recommended Operating Conditions

Characteristic

Symbol

Min. Typ. Max. Unit

Supply voltage

Forward current

Peak on−state current

Operating temperature

VAC

―

―

120

Vac

IF

15

20

25

mA

ITP

―

―

1

A

Topr

−25 ―

85

°C

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.

2

2007-10-01

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