TLP2095 Ver la hoja de datos (PDF) - Toshiba

Número de pieza

componentes Descripción

Fabricante

TLP2095

TOSHIBA PHOTOCOUPLER IRED & PHOTO-IC

Toshiba 

Soldering and Storage

TLP2095

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

∙Temperature profile example of lead (Pb) solder

(°C)

240

210

160

140

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum

temperature corresponding to the

solder paste type used by the

customer within the described profile.

60 to 120s

less than 30s

Time

(s)

∙Temperature profile example of using lead (Pb)-free solder

(°C)

260

230

190

180

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum

temperature corresponding to the

solder paste type used by the

customer within the described profile.

60 to 120s

30 to 50s

Time

(s)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

・Please preheat it at 150°C between 60 and 120 seconds.

・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated

at most once.

© 2019

6

Toshiba Electronic Devices & Storage Corporation

2019-06-03

Share Link: