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TLP1243C8 Ver la hoja de datos (PDF) - Toshiba

Número de pieza
componentes Descripción
Fabricante
TLP1243C8 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
TLP1243(C8)
Recommended Connector
Mini CT connector (1.5-mm pitch, receptacle assembly/housing crimp type) made by
Tyco Electronics AMP, Ltd.
Housing-Terminal
En Block Type
Type
Model Number Terminal Material
Receptacle
assembly
Housing crimp type
353293-3
353908-3
Phosphor bronze
AWG Size
External Diameter of
Insulation Coating
AWG26 to 28 0.85 mm to 0.95 mm
Note: For further details of connector characteristics, please contact the relevant connector manufacturer.
Precautions
Protect the device from ambient light interference. The integrated phototransistor is insensitive to light below
700 nm (e.g., fluorescent light), but is sensitive to light above 700 nm (e.g., incandescent light). If it detects
ambient light, it may cause malfunction. Be sure to make a thorough evaluation of the equipment in which the
device is to be used.
Care must be taken regarding the environment in which the device is to be installed. Oil or chemicals may
cause the package to melt or crack.
When attaching the device to the metal board, always hold the body of the device. Do not hold the device by the
connector. Ensure that the board is flat, and not warped or twisted. Attach the device to the metal board at
room temperature.
Toshiba recommends attaching the device to the smoother side of the board.
Toshiba recommends testing the attachment strength beforehand by actually attaching a device to the board.
Do not apply solder to the pins of the device's connector. Make sure that the connector is plugged into the Mini
CT connector or equivalent connector.
When inserting or removing the Mini CT connector or equivalent connector, always grasp it and its cable firmly
and either plug it straight into or pull it straight out of the device's connector. If the Mini CT connector or
equivalent connector is inserted or removed at an angle, both the device's connector and the Mini CT connector
or equivalent connector may get damaged, resulting in an unreliable connection.
Conversion efficiency decreases over time due to current flow in the infrared LED. When designing a circuit,
take into account this change in conversion efficiency over time. The ratio of fluctuation in conversion efficiency
to fluctuation in infrared LED optical output is 1:1:
IC/IF (t) = Po (t) .
IC/IF (0) Po (0)
The leadframe of the package is exposed as shown below. Ensure that no conductive material or object (such as
a metal pin) comes into contact with the leads of the leadframe and shorts them together. Care must be taken
when designing a chassis.
Top View
Connector
Leads (1) to (5) of the leadframe shown
(1)
(2)
on the left must not be shorted together.
(3)
(4) (5)
3
2007-10-01

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